发明名称 STACKING TYPE WAFER LENS PACKAGE AND MANUFACTURING METHOD
摘要 A stacking type wafer lens package and a manufacturing method thereof are provided to maintain gap between a pair of wafer lens arrays regularly by individually interposing a spacer having a hole, which a wafer lens is inserted, inside a burr. A stacking type wafer lens package comprises a pair of wafer lens arrays(101,102), and a spacer(200). In a pair of wafer lens arrays, a plurality of wafer lenses are formed on the upper side or the lower side of the wafer. In the spacer, a hole in which the wafer lens is inserted is formed and a pair of the wafer lenses are interposed between a pair of wafer lens arrays.
申请公布号 KR20090081741(A) 申请公布日期 2009.07.29
申请号 KR20080007786 申请日期 2008.01.25
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK, SUNG SOO;CHANG, IN CHEOL;LEE, SEOK CHEON;LEE, CHEONG HEE;JIN, YOUNG SU;LEE, JIN UK
分类号 G01B9/02 主分类号 G01B9/02
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