发明名称 |
STACKING TYPE WAFER LENS PACKAGE AND MANUFACTURING METHOD |
摘要 |
A stacking type wafer lens package and a manufacturing method thereof are provided to maintain gap between a pair of wafer lens arrays regularly by individually interposing a spacer having a hole, which a wafer lens is inserted, inside a burr. A stacking type wafer lens package comprises a pair of wafer lens arrays(101,102), and a spacer(200). In a pair of wafer lens arrays, a plurality of wafer lenses are formed on the upper side or the lower side of the wafer. In the spacer, a hole in which the wafer lens is inserted is formed and a pair of the wafer lenses are interposed between a pair of wafer lens arrays.
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申请公布号 |
KR20090081741(A) |
申请公布日期 |
2009.07.29 |
申请号 |
KR20080007786 |
申请日期 |
2008.01.25 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK, SUNG SOO;CHANG, IN CHEOL;LEE, SEOK CHEON;LEE, CHEONG HEE;JIN, YOUNG SU;LEE, JIN UK |
分类号 |
G01B9/02 |
主分类号 |
G01B9/02 |
代理机构 |
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