发明名称 ELECTRONIC DEVICE AND PROCESS FOR MANUFACTURING SAME
摘要 An electronic device wherein an electronic element is electrically connected to a substrate through an interposer and a method of manufacturing the same are disclosed. The electronic device comprises an electronic element and an interposer including an interposer base to which the electronic element is joined and plural post electrodes connected to corresponding electrodes of the electronic element. In the electronic device, the electronic element and the interposer base are integrated with each other by being brought into direct contact with each other, and the post electrodes are formed directly on the corresponding electrodes of the electronic element.
申请公布号 EP1681717(A4) 申请公布日期 2009.07.29
申请号 EP20040799450 申请日期 2004.11.01
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 TAKAIKE, EIJI
分类号 H01L23/12;H01L21/60;H01L23/498;H01L23/538 主分类号 H01L23/12
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