A CHUCKING SYSTEM AND METHOD FOR MODULATING SHAPES OF SUBSTRATES

摘要

The present invention is directed to a chucking system (40) and method for modulating shapes of a substrate (26), having first (26b) and second opposed surfaces (26a). This is achieved by creating a pressure differential between differing regions of the first opposed surface to attenuate structural distortions in the second opposed surface that results from external forces bearing on the substrate. To that end, the chucking system includes a chuck body having first and second opposed sides. A side surface extends therebetween. The first side includes first (58) and second (60) spaced-apart support regions. The first support region cinctures the second support region and the first (52) and second (54) recesses.; The second support region cinctures the second recess, with a portion of the body in superimposition with the second recess being transparent to radiation having a predetermined wavelength. The second side and the side surface define exterior surfaces.