| 摘要 |
A semiconductor device is manufactured using dicing of a semiconductor wafer. The semiconductor device includes a substrate (10), a base insulating layer (11) formed on the substrate, a semiconductor element (20) formed on the base insulating layer, and a separate pattern portion (15) formed on an end portion of the substrate separately from the base insulating layer. The separate pattern portion prevents the base insulating layer from being peeled off from the substrate when the dicing is performed. |
