| 摘要 |
A circuit module comprises a rigid thermally conductive substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The substrate 14 has a thermal extension 16T, preferably at the edge opposite the contacts, to assist in the dissipation of heat from the CSPs. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. |
