| 摘要 |
A semiconductor chip test socket is provided to make electrical contact among a semiconductor chip, text socket, and a connected substrate stable. In a socket guide(100), a mount receiving part(110) for mounting a semiconductor chip is formed. A chip mount housing(200) is formed in the mount receiving part of the socket guide. In the lower part of the chip mount housing, a base receiving part caving into an inner side is formed. In a connector housing(300), a combining aperture(310) penetrated toward top and bottom is formed. A connector(400) is combined with the combining aperture of the connector housing. The lower part of the connector is contacted with a substrate. The upper part of the connector is contacted with the semiconductor chip. |
