MOUNTING SUBSTRATE AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE USING THE SAME

摘要

A mounting substrate and a method for manufacturing a semiconductor package using the same are provided to mount a semiconductor chip in a mounting substrate in a reflow process of a solder ball in order to improve the reliability of the completed semiconductor package. A mounting substrate(100) comprises a substrate(110), a bonding pad(120) and an induction heating pad(130). The bonding pad is formed on the substrate. The bonding pad is contacted with a solder ball(200) for mounting a semiconductor chip. The induction heating pad is arranged adjacent to the bonding pad. The induction heating pad is inductively heated by an applied AC magnetic field to reflow the solder ball.