发明名称 |
Microelectronic device,method of protecting wirebonds,lens support and wirebond protector |
摘要 |
A wirebond protector has an elongated shape that corresponds to the elongated array of wirebonds along the edge of a microelectronic device that connect a semiconductor die to electrical conductors on a substrate. In making the microelectronic device with wirebond protection, wirebonds are first formed in the conventional manner The wirebond protector is then attached to the device in an orientation in which it extends along the array of wirebonds to at least partially cover the wirebonds. |
申请公布号 |
GB0910496(D0) |
申请公布日期 |
2009.07.29 |
申请号 |
GB20090010496 |
申请日期 |
2009.06.17 |
申请人 |
AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD |
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