发明名称 |
LOW COST HIGH CONDUCTANCE CHAMBER |
摘要 |
<p>A process chamber having high conductance and a method of manufacturing the process chamber are disclosed. The process chamber is machined from a single piece of aluminum where a process cavity and a pump cavity are created by intersecting cylinders. A substrate opening is also created at a bottom of the process cavity to provide conduit for services, such as cooling gas and electrical connections. A large undercut area is formed at a top of the pump cavity between the pump cavity and the process cavity. The undercut extends past the process chamber centerline at the process cavity. A circular saw is used to remove material and create a plenum which extends beyond the process cavity centerline.</p> |
申请公布号 |
SG153766(A1) |
申请公布日期 |
2009.07.29 |
申请号 |
SG20080092348 |
申请日期 |
2008.12.15 |
申请人 |
INTEVAC, INC. |
发明人 |
SAMIR, TUGRUL;BARNES, MICHAEL S.;BLUCK, TERRY |
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