Method of manufacturing a semi conductor device

摘要

A method of manufacturing a semiconductor device comprising a power semiconductor, a drive circuit, and a protection circuit that are integrated into the same package, is characterized in that: the method includes the step of setting the resistance value of a shunt resistor provided in series with output lines from said power semiconductor to detect an output current, at a predetermined value by selecting from various possible configurations the bonding positions on conductive bonding regions of the shunt resistor, of wires connecting said output lines and said shunt resistor together.