| 摘要 |
A manufacturing method of a semiconductor package for manufacturing a curing apparatus and semiconductor package using the same is provided to prevent the particle defect generation and prevent the growth of the deformity of the reliability test. A semiconductor package for manufacturing a curing apparatus(100) solidifies the molding material molding the semiconductor chip adhered on the substrate. The semiconductor package for manufacture curing apparatus comprises an oven(101), a guide, a pressure application plate, and a pressure application unit. The substrate in which the semiconductor chip is molded is settled. The pressure application plate is arranged inside guide. The pressure application plate fixes substrate with pressure. The pressure application unit is arranged in the guide upper. The pressure application unit is connected to the pressure application plate.
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