发明名称 FABRICATION METHOD OF NITRIDE SEMICONDUCTOR SUBSTRATE
摘要 A method for manufacturing a nitride semiconductor substrate is provided to obtain the nitride semiconductor substrate with a large diameter with a low cost. A hexagonal buffer layer(20) is formed on a surface(100) of a Si substrate(10). An epitaxial growth of a nitride semiconductor layer(30) is performed on the buffer layer. The buffer layer includes at least one of AlN, TiN, HfN, GaN, InN or ZrN. The formation step of the buffer layer includes a crystallization step by a thermal process of an amorphous layer formation step.
申请公布号 KR20090081879(A) 申请公布日期 2009.07.29
申请号 KR20080008030 申请日期 2008.01.25
申请人 SAMSUNG ELECTRONICS CO., LTD.;SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATION 发明人 PARK, SUNG SOO;YOON, DAE HO
分类号 H01L33/00 主分类号 H01L33/00
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