STRUCTURE BODY FOR FIXING SEMICONDUCTOR SAFELY, AND PRODUCTION METHOD THEREOF

摘要

A structure body for safely accommodating a semiconductor device and a manufacturing method thereof are provided to stably support a semiconductor device temporarily fixed in order to test electrical signals of the semiconductor device. A structure body for safely accommodating a semiconductor device includes a fixing member, a body and an accommodating member. The fixing member(110) is coupled to a test tray. The body(120) is installed at the fixing member. Semiconductor device receiving grooves are formed at the body in order to guide accommodation or separation of the semiconductor device. The accommodating member(130) supports the bottom of the semiconductor device so as to contact solder balls formed at the bottom of the semiconductor device with a tester.