发明名称 |
PACKAGE-ON-PACKAGE SECURE MODULE HAVING BGA MESH CAP |
摘要 |
A package-on-package (POP) secure module includes a BGA mesh cap, a first BGA package, and a second BGA package. The first BGA package includes a first integrated circuit (for example, a microcontroller that includes tamper detect logic). The second BGA package includes a second integrated circuit (for example, a memory). The second BGA package is piggy-back mounted to the first BGA package and the BGA mesh cap is piggy-back mounted to the second BGA package. A printed circuit board substrate member of the BGA mesh cap includes an embedded anti-tamper mesh. This mesh is connected in a protected manner within the module to the first integrated circuit. When the module is in use, a mesh embedded in an underlying printed circuit board is coupled to the BGA cap mesh so that both anti-tamper meshes are controlled by the tamper detect logic. |
申请公布号 |
EP2013907(A4) |
申请公布日期 |
2009.07.29 |
申请号 |
EP20070836686 |
申请日期 |
2007.08.10 |
申请人 |
ZILOG, INC. |
发明人 |
EATON, DAVID, D.;STAAB, DAVID, R.;ZETA, RUBEN, C. |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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