SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor package and a manufacturing method thereof for reducing thickness are provided to reduce parasitic capacitance generated by the structure and prevent the semiconductor package wafer bends. A semiconductor package(100) includes a semiconductor chip, a penetrating electrode, and a rerouting operation. The semiconductor chip has the bonding pad and stepped portion. The bonding pad is arranged in the first side. The penetrating electrode passes through the bonding pad and semiconductor chip. The first end of rerouting is electrically connected to the penetrating electrode. The second end of rerouting is arranged on the stepped portion. It is faced with the second end with the first end.