发明名称 SUBSTRATE TREATMENT APPARATUS
摘要 A substrate processing apparatus is provided to reduce a time of positioning a substrate on a substrate chuck and to position the substrate accurately by using a plurality of position sensors. A substrate processing apparatus includes a chamber(20), a substrate chuck, a plurality of position sensors(42,43,44). A chamber provides a space for a process. A substrate chuck is positioned inside the chamber. The substrate chuck fixes the substrate. The plurality of position sensors are installed in an upper part of the substrate chuck. The plurality of position sensors determine whether the substrate is rightly positioned. The plurality of position sensors are installed along the edge of the substrate which is rightly positioned.
申请公布号 KR20090081689(A) 申请公布日期 2009.07.29
申请号 KR20080007685 申请日期 2008.01.24
申请人 SEMES CO., LTD. 发明人 JUNG, KYUNG HWA
分类号 H01L21/68;H01L21/683 主分类号 H01L21/68
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