发明名称 |
Method of making solder pad |
摘要 |
A method of making a solder pad includes providing a substrate having a metal layer formed on it, and applying a photo resist to the metal layer. The photo resist is patterned. A first etching operation is performed on the metal layer to form voids in the metal layer. A second etching operation is performed on the metal layer to form the solder pad. A solder mask is formed on the substrate and a portion of the solder pad.
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申请公布号 |
US7566648(B2) |
申请公布日期 |
2009.07.28 |
申请号 |
US20070738514 |
申请日期 |
2007.04.22 |
申请人 |
FREESCALE SEMICONDUCTOR INC. |
发明人 |
YIP HENG KEONG;CHANG THOON KHIN;FOONG CHEE SENG |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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