发明名称 Multilayer chip capacitor
摘要 There is provided a multilayer chip capacitor including: a capacitor body including first and second capacitor units; and first to fourth outer electrodes, wherein the first capacitor unit includes at least one pair of first and second inner electrodes, the second capacitor unit includes at least one pair of third and fourth inner electrodes, an alternate laminated portion is formed in one area within the capacitor body, the alternate laminated portion having the first to fourth inner electrodes sequentially laminated therein, and a capacitance adjusting portion is formed in another area within the capacitor body, the capacitance adjusting portion having at least one of the one pair of first and second inner electrodes and the one pair of third and fourth inner electrodes laminated repeatedly.
申请公布号 US7567425(B1) 申请公布日期 2009.07.28
申请号 US20080339839 申请日期 2008.12.19
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE BYOUNG HWA;WI SUNG KWON;CHO HONG YEON;PARK DONG SEOK;PARK SANG SOO;PARK MIN CHEOL
分类号 H01G4/228 主分类号 H01G4/228
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