发明名称 |
DICING TAPES FOR SEMI-CONDUCTOR PACKAGING AND MANUFACTURING METHOD THEREOF |
摘要 |
A dicing tape for the semiconductor packaging is provided to inhibit the migration of a plasticizer and an additive of a PVC film, thereby improving the pick-up in the semiconductor packing process, room temperature stability and durability. A dicing tape(1) for the semiconductor packaging comprises a base film(5), an adhesive layer(3) and a release film(2), wherein a curing resin layer(4) having a storage modulus of 4.0x10^4 dyne/cm^2 or more is formed between the base film and the adhesive layer. The base film is a poly(vinyl chloride) film. The curing resin layer is formed by curing a curing resin layer composition with UV rays, heat or radioactive rays. |
申请公布号 |
KR20090081103(A) |
申请公布日期 |
2009.07.28 |
申请号 |
KR20080006993 |
申请日期 |
2008.01.23 |
申请人 |
CHEIL INDUSTRIES INC. |
发明人 |
SONG, GYU SEOK;CHUNG, CHANG BEOM;HWANG, YONG HA;HA, KYOUNG JIN;CHO, JAE HYUN;PARK, BAEK SOUNG |
分类号 |
C09J133/08;H01L21/48;H01L21/50 |
主分类号 |
C09J133/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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