发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE |
摘要 |
<p>A manufacturing method of a semiconductor package is provided to manufacture a semiconductor package with a simple process and a low cost by bumping a bump ball through an existing wire bonder device. A first pre-substrate(10a) having the same size as a substrate of a strip unit is included by using a molding compound resin. A plurality of semiconductor chips(20) is attached on a surface of the first pre-substrate. A bump ball(30) is formed on a bonding pad of each semiconductor chip attached on the first pre-substrate through a wire bonder device. The first pre-substrate is attached on a substrate of the strip unit. The bump ball formed on the bonding pad of each semiconductor chip is attached on a conductive pattern for contacting the substrate. The semiconductor chip is connected to the substrate.</p> |
申请公布号 |
KR20090081036(A) |
申请公布日期 |
2009.07.28 |
申请号 |
KR20080006877 |
申请日期 |
2008.01.23 |
申请人 |
AMKOR TECHNOLOGY KOREA, INC. |
发明人 |
CHOUNG, JI YOUNG |
分类号 |
H01L23/48;H01L21/78;H01L23/28 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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