发明名称 |
Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures |
摘要 |
An integrated circuit device structure and a process for fabricating the structure wherein the power bus interconnect structure is formed in the aluminum pad or contact layer. An interconnect structure for interconnecting underlying levels of interconnect can also be formed in the aluminum pad layer. |
申请公布号 |
US7566964(B2) |
申请公布日期 |
2009.07.28 |
申请号 |
US20030675258 |
申请日期 |
2003.09.30 |
申请人 |
AGERE SYSTEMS INC. |
发明人 |
KANG SEUNG H.;KREBS ROLAND P.;STEINER KURT GEORGE;AYUKAWA MICHAEL C.;MERCHANT SAILESH MANSINH |
分类号 |
H01L23/52;H01L21/3205;H01L21/768;H01L21/82;H01L23/528;H01L23/532 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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