发明名称 METHOD OF FORMING BONDED BODY AND BONDED BODY
摘要 <p>A bonded body and a method for producing the same are provided to firmly and accurately connect two base materials and to effectively bond them even at low temperatures. A method for producing a bonded body comprises: a first step of forming bonding layers(31,32) on a first base material(21) and a second base material(22) respectively using a chemical vapor deposition method; a second step of placing the bonding layers to face each other and giving compressive force to the first and second base materials while attaching the first base material to the second base material; and a third step of bonding the bonding layers to obtain a bonded body. The bonding layer is composed of copper and an organic component.</p>
申请公布号 KR20090081330(A) 申请公布日期 2009.07.28
申请号 KR20090004084 申请日期 2009.01.19
申请人 SEIKO EPSON CORPORATION 发明人 SATO MITSURU;YAMAMOTO TAKATOSHI
分类号 H01L21/02 主分类号 H01L21/02
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