| 发明名称 |
Composition for removing an insulation material and related methods |
| 摘要 |
A composition for removing an insulation material and related methods of use are disclosed. The composition comprises about 1 to 50 percent by weight of an oxidizing agent, about 0.1 to 35 percent by weight of a fluorine-containing compound, and water. The insulation material comprises at least one of a low-k material and a protection material.
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| 申请公布号 |
US7566666(B2) |
申请公布日期 |
2009.07.28 |
| 申请号 |
US20060500434 |
申请日期 |
2006.08.08 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD.;DONGWOO FINE-CHEM CO., LTD. |
发明人 |
LEE CHUN-DEUK;MYUNG JUNG-JEA;PARK MYUN-KYU;KANG DONG-MIN;SON BYOUNG-WOO;TAKASHIMA MASAYUKI;KIM YOUNG-NAM;KIM HYUN-JOON |
| 分类号 |
H01L21/461 |
主分类号 |
H01L21/461 |
| 代理机构 |
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