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发明名称
RESIN MOLDING APPARATUS INCLUDING THICKNESS MEASUREMENT UNIT
摘要
申请公布号
KR20090007620(U)
申请公布日期
2009.07.28
申请号
KR20080001056U
申请日期
2008.01.23
申请人
发明人
分类号
H01L23/28;H01L21/66
主分类号
H01L23/28
代理机构
代理人
主权项
地址
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