发明名称 Semiconductor module
摘要 An image sensor module is composed of a base, a CCD image sensor, a glass plate, and a frame-shaped moisture permeable member. The base has a depressed chip chamber, in which the CCD image sensor is contained. Top and under surfaces of the moisture permeable member are provided with adhesive layers. The base and the glass plate are attached above and below the moisture permeable member through the adhesive layers, and the chip chamber is sealed. The moisture permeable member has the property to block liquid water while transmit water vapor, and releases the water vapor produced by the heat of the CCD image sensor from the inside to the outside of the chip chamber.
申请公布号 US7566965(B2) 申请公布日期 2009.07.28
申请号 US20060449824 申请日期 2006.06.09
申请人 FUJIFILM CORPORATION 发明人 SENBA TAKEHIKO;SASAKI KATSUHIRO;MISAWA TAKESHI
分类号 H01L23/10 主分类号 H01L23/10
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