METHOD FOR FABRICATING OF SEMICONDUCTOR PACKAGE

摘要

A manufacturing method of a semiconductor package is provided to form a high density semiconductor package by reducing thickness of a semiconductor package. A semiconductor chip(110) is attached on a substrate(100). A first molding part(140) is formed on a top surface of the semiconductor chip. A second molding part(170) is formed on a top surface of the substrate, and surrounds the semiconductor chip. In a process for forming the first molding part, a material for forming the molding part is coated and is hardened on a base film. The hardened material is cut into a size corresponding to the semiconductor chip. The cut material is attached on the semiconductor chip.