发明名称 RESISTIVE RANDOM ACCESS MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 <p>A resistive memory device is provided to prevent thermal degradation of a diode and a resistance change layer by including a protecting layer. A resistive memory device includes a storage node, a switching device, and a protecting layer(140). The storage node includes a resistance change layer(110). The switching device is connected to the storage node. The protecting layer covers a part exposed of the resistance change layer, is made of material which does not a silicide reaction with the resistance change layer, is a material layer which prevents hydrogen permeation, and includes at least one among aluminum oxide and titanium oxide. The resistance change layer is a metal oxide layer.</p>
申请公布号 KR20090080751(A) 申请公布日期 2009.07.27
申请号 KR20080006702 申请日期 2008.01.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, KI HWAN;PARK, YOUNG SOO;LEE, MYOUNG JAE;WENXU XIANYU;AHN, SEUNG EON;LEE, CHANG BUM
分类号 H01L27/115 主分类号 H01L27/115
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