| 摘要 |
<p>A light emitting diode chip 1 is mounted on the surface of a circuit board 2 which has on the surface both a region for mounting the chip 21, and conductors 22 for connecting to the chip via lead wires 12. A hollow mold (fig 1; 3) is placed over the LED chip, and transparent material such as resin is injected into the mold under vacuum extraction to encapsulate the chip, after which the mold is removed. The transparent material solidifies to form a packaging layer 4. The mold can be semicircular in shape, or trapezoidal in cross-section, and can be faceted to form a microlens or pavilion cut shape. Because the LED chip is not recessed in the circuit board, emitted light is not obstructed by recess walls or other parts of the circuit board, allowing a light extraction angle of about 180{</p> |
