| 摘要 |
A packing apparatus and a packing method of wafers packed in a drafting paper overlap having a widthwise tear tape is provided to tear open and to eat packed wafers conveniently by making a tear tape formed in the drafting paper overlap wound in the width direction of wafers when packing with a drafting paper overlap after gathering wafers evenly. A packing apparatus and a packing method of wafers packed in a drafting paper overlap having a widthwise tear tape comprises a transfer conveyor(120) conveying wafers(10) cut into the fixed length and width and arranged evenly in the width direction, a separator plate(130) separating plural wafers according to the number to be packed at the end of the transfer conveyor and pushing in the vertical direction, an alignment frame(140) receiving the wafers separated by the separator plate and arranging, a conveying plate(150) pushing in the width direction of the wafers arranged on the alignment frame, and a packing unit having a drafting paper overlap(100) and a tear tape(110) to make the wafers conveyed by the conveying plate to be covered and packed in the width direction.
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