发明名称 |
ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD |
摘要 |
<p>An electromagnetic band-gap structure and a printed circuit board are provided to shield a coupling noise of a high frequency when an operation frequency having a high frequency band is used. An electromagnetic band gap structure wafer(300) comprises a dielectric layer and a plurality of conductive plates, a stitching via, and a through via. A switching bar penetrates a dielectric layer and connects the conductive plate by passing the conductive plate and the other plane. The trough via passes a clearance hole formed on a conductive plate and connects two conductive layers electrically.</p> |
申请公布号 |
KR20090080462(A) |
申请公布日期 |
2009.07.24 |
申请号 |
KR20080057444 |
申请日期 |
2008.06.18 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KOO, JA BU;HAN, MI JA;KIM, HAN |
分类号 |
H05K9/00;H04B1/10;H05K1/02 |
主分类号 |
H05K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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