发明名称 ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD
摘要 <p>An electromagnetic band-gap structure and a printed circuit board are provided to shield a coupling noise of a high frequency when an operation frequency having a high frequency band is used. An electromagnetic band gap structure wafer(300) comprises a dielectric layer and a plurality of conductive plates, a stitching via, and a through via. A switching bar penetrates a dielectric layer and connects the conductive plate by passing the conductive plate and the other plane. The trough via passes a clearance hole formed on a conductive plate and connects two conductive layers electrically.</p>
申请公布号 KR20090080462(A) 申请公布日期 2009.07.24
申请号 KR20080057444 申请日期 2008.06.18
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KOO, JA BU;HAN, MI JA;KIM, HAN
分类号 H05K9/00;H04B1/10;H05K1/02 主分类号 H05K9/00
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