发明名称 PRINTED CIRCUIT BOARD FOR LIGHT EMITED DIODE MODULE AND ITS MAKING METHOD
摘要 A printed circuit board for a light emitted diode module and its making method are provided to improve the efficiency of an emitting diode by forming an aluminum film which is made of epoxy resin and aluminum. A printed circuit board for a light emitted diode module and its making method are comprised of the steps: An aluminum laminated film(110) which is formed by laminating the aluminum film on a semi-cure resin or a pre-preg is laminated on a copper foil laminated film(100) in which the printed circuit is formed; and the copper foil laminated film and aluminum laminated film are patterned and a groove is formed by a laser.
申请公布号 KR20090080290(A) 申请公布日期 2009.07.24
申请号 KR20080006165 申请日期 2008.01.21
申请人 KOREA PHOTONICS TECHNOLOGY INSTITUTE 发明人 KIM, YOUNG WOO;KIM, JAE BUM;KIM, MIN SUNG;JEONG, HYUN SUNG
分类号 H01L33/20 主分类号 H01L33/20
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