An LED module with a cooling structure is provided to maintain a temperature range during the time the light is turned on and off, thereby improving lighting efficiency of an LED package. An LED package is mounted on the top of a substrate(100). A circuit pattern is printed on the mounted LED package to supply the power thereto. The top of a cooling substrate(200) is closely attached to the bottom of the substrate and includes a plurality of heat radiating pins(210) which are protruded from the bottom of the combination. An upper heat conductor(300) is laminated on the top of the cooling substrate. A lower heat conductor(400) is laminated on the bottom of the cooling substrate.
