发明名称 SOCKET PROVIDED WITH PRESSURE CONDUCTIVE RUBBER PIN
摘要 A conductive rubber pin for employing conductive rubber pins and solder balls of semiconductor packets are provided to replace the conductive rubber pin individually and perform maintenance of the socket. A plurality of through holes(110) is formed in a body. Conductive rubber pins are employed and inserted inside the through holes. The through holes are formed in the center of conductive rubber pins. The metal terminals are equipped in upper parts of conductive rubber pins. The inclined guides are formed in the tops of penetration holes. Inclined guides induced with solder balls are in the home position. The step spaces are formed in the lower unit of penetration holes.
申请公布号 KR20090077991(A) 申请公布日期 2009.07.17
申请号 KR20080003725 申请日期 2008.01.14
申请人 MICRO CONTACT SOLUTION CO., LTD. 发明人 OH, SEONG KYUNG
分类号 H01R33/76;H01L21/66 主分类号 H01R33/76
代理机构 代理人
主权项
地址