| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition in which a modulus of elasticity as a cured material is reduced and a glass transition temperature is improved while quick curability is maintained even when moisture is absorbed, an epoxy resin composition for semiconductor sealing using the same, and a semiconductor device excellent in reliability in which warpage is reduced. <P>SOLUTION: The epoxy resin composition comprises an epoxy resin (A), a curing agent (B), and an imide ring substituted phenolic compound (C), wherein the epoxy resin composition is characterized by that a specific monofunctional phenolic compound (C) comprising nitrogen and two ketones has a hydrolysis rate of 50 mol% or less after processing for 1 hour at 140°C in a solution in which equivalent amounts of pyridine solution of hydrochloric acid of 1.2 mol/l and water are mixed. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
