| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive for electronic component which can prevent the warpage or the like of the electronic component and has excellent adhesion reliability. <P>SOLUTION: In the adhesive for electronic component containing a multifunctional epoxy compound having an epoxy equivalent of 50 to 150 and an acid anhydride having at least one skeleton selected from the group consisting of the following (a), (b) and (c) in its molecule. The cured product of the adhesive has glass transition temperature (Tg) of 110 to 150°C, storage elastic modulus of 1,000 to 4,000 MPa at 10 to 50°C, and MPa minimum storage elastic modulus of≥40 at≥170°C. (a) a 10-30C alkyl group, (b) a 10-30C alkenyl group, (c) a 10-30C aralkyl group. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
