| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the following problem that may be encountered when IGBT modules are connected in parallel: variation in temperature is caused in a IGBT chip due to variation in characteristic or structure and, if the temperature is suppressed to an absolute maximum temperature, the size of equipment is increased and this leads to increased cost. <P>SOLUTION: Each module with an embedded temperature detecting sensor is provided with a temperature detector. The magnitude of the difference in temperature between them is determined by a comparator 19. The turn-on timing of a high-temperature module is delayed by an integration circuit of a resistor 25a and a capacitor 22a and its temperature is thereby reduced. <P>COPYRIGHT: (C)2009,JPO&INPIT |
