| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus having a high productivity per installed area. SOLUTION: In a vacuum treatment apparatus 100 provided with a plurality of cassette tables 109 on which cassettes are placed, a vacuum feed chamber arranged in a back face side of the atmospheric air feed chamber in a state of being coupled thereto, having a polygonal plane shape and constituted so that the wafer is fed in a depressurized inner portion, and a plurality of vacuum treatment chambers detachably coupled to a side surface of the vacuum feed chamber, arranged in adjacent thereto and treating the wafer fed to an inner portion from the vacuum feed chamber, the plurality of vacuum treatment apparatuses include a plurality of etching treatment chambers carrying out the etching treatment of the wafer and at least one ashing treatment chamber carrying out the ashing treatment of the wafer, the ashing treatment chamber is coupled to a side surface in one of right and left sides as seen from the front face of the vacuum feed chamber, and the atmospheric air feed chamber is arranged so as to be biased to the one side to which the ashing treatment chamber is coupled. COPYRIGHT: (C)2009,JPO&INPIT |
