发明名称 |
IMAGE SENSING DEVICES AND METHODS FOR FABRICATING THE SAME |
摘要 |
Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device comprises a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.
|
申请公布号 |
US2009181490(A1) |
申请公布日期 |
2009.07.16 |
申请号 |
US20090407115 |
申请日期 |
2009.03.19 |
申请人 |
VISERA TECHNOLOGIES COMPANY LIMITED |
发明人 |
WENG JUI-PING;LIN TZU-HAN;ZUNG PAI-CHUN PETER |
分类号 |
H01L31/18 |
主分类号 |
H01L31/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|