发明名称 |
METHODS OF FORMING HIGH DENSITY METAL WIRING FOR FINE LINE AND SPACE PACKAGING APPLICATIONS AND STRUCTURES FORMED THEREBY |
摘要 |
Methods of forming microelectronic device structures are described. Those methods may include forming at least one opening through a build up structure and a photo sensitive material disposed on the build up structure, wherein the build up structure comprises a portion of a package substrate, filling the at least one opening with a metal containing nanopaste, and sintering the metal containing nanopaste to form a bulk property metal structure in the at least one opening. |
申请公布号 |
WO2009088592(A1) |
申请公布日期 |
2009.07.16 |
申请号 |
WO2008US85279 |
申请日期 |
2008.12.02 |
申请人 |
INTEL CORPORATION;HWANG, CHI-WON;TOMITA, YOSHIHIRO |
发明人 |
HWANG, CHI-WON;TOMITA, YOSHIHIRO |
分类号 |
H01L23/48;G05F1/00;H01L23/52 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|