发明名称 |
APPARATUS AND METHOD OF ALIGNING AND POSITIONING A COLD SUBSTRATE ON A HOT SURFACE |
摘要 |
<p>Embodiments of the invention contemplate a method, apparatus and system that are used to support and position a substrate on a surface that is at a different temperature than the initial, or incoming, substrate temperature. Embodiments of the invention may also include a method of controlling the transfer of heat between a substrate and substrate support positioned in a processing chamber. The apparatus and methods described herein generally may also provide an inexpensive and simple way of accurately positioning a substrate on a substrate support that is positioned in a semiconductor processing chamber. Substrate processing chambers that can benefit from the various embodiments described herein include, but are not limited to RTP, CVD, PVD, ALD, plasma etching, and/or laser annealing chambers.</p> |
申请公布号 |
WO2009089248(A2) |
申请公布日期 |
2009.07.16 |
申请号 |
WO2009US30275 |
申请日期 |
2009.01.07 |
申请人 |
APPLIED MATERIALS, INC.;KOELMEL, BLAKE;MAYUR, ABHILASH, J.;MA, KAI;LERNER, ALEXANDER N. |
发明人 |
KOELMEL, BLAKE;MAYUR, ABHILASH, J.;MA, KAI;LERNER, ALEXANDER N. |
分类号 |
H01L21/68;H01L21/20;H01L21/30;H01L21/32 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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