| 摘要 |
<p>Electrical and optical isolation are achieved for circuits in a semiconductor device. According to an example embodiment, optical isolation material (e.g., 152) optically isolates circuit components (e.g., 120, 122) in a semiconductor substrate and electrically connects one or more circuit nodes in the substrate. Electrical isolation material (e.g., 140) electrically isolates the circuit components. The optical isolation material may be formed in a single step, with different portions of the isolation material operating to respectively isolate (e.g., 152) and electrically connect (e.g., 150, 154) different circuit components.</p> |
