| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method which can surely divide a wafer along a predetermined dividing line even in the case of the wafer which is divided into strips and thereafter made into individual devices. <P>SOLUTION: A modified layer is formed in an intersection region 3a of a second dividing line 3 by using a dicing apparatus 10. Then, the wafer 1 is divided along a first dividing line to obtain wafer strips 1. After the wafer strips 1 are obtained, laser beam is applied along the second dividing line 3, other than the intersection region 3a by using the dicing apparatus 10 so as to form a modified layer along the second dividing line 3. Then, an external force is applied to each wafer strip 1, where the modified layer has been formed along the second dividing line 3, thereby dividing each wafer strip 1 to obtain devices 8. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
