| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an embedded printed-circuit board which forms a micro-circuit pattern, improves adhesion strength of a conductive pattern, protects the conductive pattern from an outside environment, and improves reliability of the printed-circuit board. SOLUTION: The method includes (a) a forming step of a copper laminated sheet, (b) a patterning step to form the pattern and a via hole in an insulating layer, (c) a first plated layer forming step to form the first plated layer on a surface of the copper laminated sheet, (d) a plating resist layer forming step to form the plating resist layer on a surface of the first plated layer with the pattern and the via hole excluded, (e) a second plated layer forming step to form the second plated layer in the pattern and the via hole, (f) a peeling step of the plating resist layer, (g) an etching step to remove the first plated layer, and (h) a PSR layer forming step to form the PSR layer on the surface of the copper laminated sheet. COPYRIGHT: (C)2009,JPO&INPIT
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