SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND MANUFACTURING METHOD FOR HIGH-VOLTAGE DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a technique capable of accurately detecting adhesion and accumulation of foreign bodies on a processing electrode and implementing normal voltage-resistant processing. SOLUTION: In a substrate processing device, substrate processing is carried out for removing foreign bodies on the processing target substrate by applying voltage between the processing electrode and the processing target substrate while the processing electrode is faced to the processing target substrate. The substrate processing device includes a movement mechanism for making the processing electrode face to the reference electrode by moving a reference electrode and at least one of the processing electrode and the reference electrode, and an inspection means for inspecting a sticking state of foreign bodies on the surface of the processing electrode by applying voltage between the processing electrode and the reference electrode while the processing electrode is faced to the reference electrode. COPYRIGHT: (C)2009,JPO&INPIT