WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING WIRING BOARD AND SEMICONDUCTOR DEVICE

摘要

Provided is a highly reliable wiring board wherein connecting reliability of a via hole is ensured. The wiring board has insulating layers and wiring layers alternately laminated therein, and the wiring layers are electrically connected by means of the via hole. The wiring board is provided with a first terminal, which is arranged on a first surface and embedded in an insulating layer; a second terminal, which is arranged on a second surface on the side opposite to the first surface; and a land which is arranged in the insulating layer and is brought into contact with the first terminal. The via hole which electrically connects the land and the wiring layer, which is arranged by having the insulating layer between the land and the insulating layer, does not have a connecting interface on the end portion on the land side but has a connecting interface on the end portion on the wiring layer side.