发明名称 LED MOUNTING METHOD, AND ITS PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED mounting method increasing heat radiation efficiency of an auxiliary board; and its package. <P>SOLUTION: This LED mounting method first provides a first board 10, which has an upper surface 10a, a lower surface 10b and a plurality of die-attaching regions 11. Then, a group of a plurality of heat radiation groove parts 12 is formed on the lower surface 10b, and each groove part corresponds to the die-attaching region 11, and has a bottom surface 12a, and has a mounting seat 13 between the die-attaching region 11 and itself. Then, a heat conductor 70 is formed in each heat radiation groove part 12, and a plurality of LEDs 20 are installed in the group of the die-attaching regions 11. Then, a second board 30 is provided, which has a first surface 30a, a second surface 30b, and a plurality of reflective slots 31 connecting them, corresponding to the group of the LED 20 and the group of the die-attaching regions 11. Finally, the group of the LEDs 20 is positioned in the group of the reflective slots 31 by connecting the first board 10 to the second board 30. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009158759(A) 申请公布日期 2009.07.16
申请号 JP20070336102 申请日期 2007.12.27
申请人 INTERNATL SEMICONDUCTOR TECHNOLOGY LTD 发明人 LU JIAN-AN;PAN YEN-TING
分类号 H01L33/48;H01L33/50;H01L33/60;H01L33/62;H01L33/64 主分类号 H01L33/48
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