| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed board whereof the manufacturing cost can be reduced by reducing the number of components and the interlayer connection reliability is high, and its manufacturing method. <P>SOLUTION: This multilayer printed board 10 is provided with three single-side conductor pattern films 16 each of which has a conductor pattern 13 formed on one side of a resin film 12 having a through-hole 11, and a filled through-hole 15 formed by filling a conductor 14 integrally with the conductor pattern 13 in the through-hole 11. These one side conductor pattern films 16 are placed one over another with their vertical directions made equalized. The conductor patterns 13 of the respective one side conductor pattern films 16 are electrically connected with each other through the filled through-hole 15. Since the conductor patterns 13 of the conductor pattern films 16 are connected by interlayer connection through the filled through-hole 15, the interlayer connection reliability is high. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
