发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device having target electrical characteristics. SOLUTION: A functional relationship between layout parameters and measured electrical characteristics is decided, and values of the layout parameters are extracted from design layout data of a semiconductor device given. Electrical characteristics of the semiconductor device to be manufactured from the design layout data are predicted by applying the values of the layout parameters to the functional relationship. The design layout data are changed with enumerated candidates of values of parameters instead of the values of the layout parameters extracted from the design layout data, and the design layout data of the semiconductor device are changed for manufacturing the semiconductor device. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009157573(A) 申请公布日期 2009.07.16
申请号 JP20070334030 申请日期 2007.12.26
申请人 FUJITSU MICROELECTRONICS LTD 发明人 TANAKA TAKUJI
分类号 G06F17/50;H01L21/82;H01L21/822;H01L27/04 主分类号 G06F17/50
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