PREPREG AND ITS APPLICATION PRODUCTS FOR LOW THERMAL EXPANSION AND LOW DIELECTRIC TANGENT

摘要

A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition at 50 to 100 ° C. is 50 ppm/° C. or less. A printed circuit board, multi layered circuit board, and electronic part are disclosed.