EXPOSURE METHOD, EXPOSURE DEVICE, AND DEVICE MANUFACTURING METHOD

摘要

Provided is an exposure method which can improve a throughput of an exposure step without increasing the stage speed. The method includes a step for forming on a wafer (W), a pattern corresponding to a reticle (R) pattern. The reticle (R) pattern is partially illuminated by an illumination region (21R) by an illumination light (IL) from an illumination optical system (20) and a polarization mirror (15) is rotated so as to scan the illumination region (21R) in the +Y direction (or in the -Y direction) with respect to the reticle (R) while the reticle (R) is moved in the corresponding -Y direction (or the +Y direction) and the wafer (W) is moved in the direction corresponding to the movement direction of the reticle (R).